A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors-Reference-Cited by-同舟云学术

A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors

Published:2008-08 Issue:8-9 Volume:48 Page:1562-1566
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Nötzold K.,Graf J.,Müller-Fiedler R.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

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4. Hermeticity of electronic packages;Greenhouse,2000

5. Strength and reliability properties of glass frit bonded micro packages;Glien,2004

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1. Decohesion and rupture mechanisms of a multilayered microbattery studied by 4-point bending;Journal of Power Sources;2016-12

2. Fracture Characteristics of Frit Bonding through In-Situ Nano-Indentation Testing;Journal of Materials Science & Technology;2016-11

3. Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications;Measurement Science and Technology;2014-03-19

4. Glass–Glass Laser-Assisted Glass Frit Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-12