Author:
Valentín R.,Barker Donald,Osterman Michael
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Tanaka H, Aoki Y, Yamamoto S. The mechanism of solder cracking. ESPEC Technology Report No. 3; 1997. p. 25–9.
2. Tanaka H, Aoki Y, Yamamoto S. An analysis of solder cracking mechanisms. ESPEC Technology Report No. 7; 2000. p. 7–11.
3. Thermal stress analysis of pin grid array structures: pin and solder joint problems;Engel;ASME J Electron Packag,1992
4. Thermal stress analysis of pin grid array structures: module and card interactions;Engel;ASME J Electron Packag,1992
5. Thermal stress analysis of soldered connectors for complex electronic modules;Engel;Comput Mech Eng,1984
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