The influence of electroless metallization process parameters on basic electric properties of Ni

The influence of electroless metallization process parameters on basic electric properties of Ni–P alloy

Published:2014-01 Issue:1 Volume:54 Page:200-203
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Pruszowski Z.,Ciez M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Goldstein R, Szwarc J. Zero TCR foil resistors ten fold improvement in temperature coefficient, in: Proc. 51th Electronic Components and Technology Conference, 2001, May 29–June 1 2001, Orlando, FL, USA: 1423–1426.

2. Electroless plating today;Saubestre;Met Finish,1962

3. Electroless plating today;Saubestre;Met Finish,1962

4. Electroless plating today;Saubestre;Met Finish,1962

5. Electroless plating today;Saubestre;Met Finish,1962

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