Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness

Author:

Iwamoto Nancy

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling;Iwamoto;Microelectron Reliab,2011

2. Iwamoto N. Developing the mesoscale stress–strain curve to failure. In: Proceedings of EuroSimE 2011 the 12th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Linz, Austria, April 18–20 2011.

3. Iwamoto N. Developing the stress–strain curve to failure using mesoscale models parameterized from molecular models. Microelectron Reliab 2012 .

4. Multiscale perspectives of interface delamination in microelectronic packaging applications;Iwamoto;Mol Simulation,2011

5. Project reviews from project NanoInterface funded from the Seventh Framework Program for Research and Technological Development (FP7) of the European Union (NMP3-SL-20080214371).

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1. Effect of Varying Stiffness and Functionalization on the Interfacial Failure Behavior of Isotactic Polypropylene on Hydroxylated γ-Al2O3 by MD Simulation;ACS Applied Materials & Interfaces;2023-01-20

2. Molecular Modeling for Reliability Issues;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

3. Evaluation of the Moisture Effect on the Material Interface Using Multiscale Modeling;Multiscale Science and Engineering;2019-03-18

4. Water Effects in Polymers Through Molecular Dynamics;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

5. Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects;Nanopackaging;2018

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