Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference50 articles.
1. Self-assembly from milli-to nanoscales: methods and applications;Mastrangeli;J Micromech Microeng,2009
2. Self-assembly and self-tiling: integrating active dies across length scales on flexible substrates;Knuesel;J Microelectromech Syst,2012
3. Self-assembly for microscale and nanoscale packaging: steps toward self-packaging;Morris;IEEE Trans Adv Packag,2005
4. Fearing RS. Survey of sticking effects for micro parts handling, IEEE/RSJ International Conference on Intelligent Robots and Systems 95. In: ‘Human robot interaction and cooperative robots’, proceedings, vol. 212; 1995. p. 212–7.
5. Arai F, Andou D, Fukuda T. Adhesion forces reduction for micro manipulation based on micro physics. In: The ninth annual international workshop on micro electro mechanical systems, 1996, MEMS ’96; 1996. p. 354–9.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献