Author:
Borgesen P.,Hamasha S.,Obaidat M.,Raghavan V.,Dai X.,Meilunas M.,Anselm M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Cumulative damage in fatigue;Miner;J Appl Mech,1945
2. Jaradat Y, Chen J, Owens JE, Yin L, Qasaimeh A, Wentlent L, et al. Effects of variable amplitude loading on lead free solder joint properties and damage accumulation. In: Proc ITHERM; 2012. p. 740–44.
3. On the assessment of the life of SnAgCu solder joints in cycling with varying amplitudes;Yang;IEEE Trans Compon Packag Technol,2013
4. On the fatigue life of microelectronic interconnects in cycling with varying amplitudes;Jaradat;Proc SMTA Int,2012
5. Raghavan VA, Roggeman B, Meilunas M, Borgesen P. Effects of pre-stressing on solder joint failure by pad cratering. In: Proc 60th ECTC; 2010.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献