Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference38 articles.
1. Semiconductor Industry Association. The international technology roadmap for semiconductors. http://public.itrs.net, 2003.
2. Reichl H, Michel B, Schubert A. Materials Science and Engineering—A MajorTopic in the Future of Micro-electronic Packaging. Proc. 3. Int. Conf. Micromaterials, April 17–19, 2000, p. 72–73.
3. Thermal Stress and Strain in Microelectronic Packaging;Lau,1993
4. Wunderle B, Schacht R, Wittler O, Michel B, Reichl H. Perfromance and thermo-mechanical reliability of micro-channel coolers—a parametric study. Itherm Conference, Las Vegas, USA, June 1–4: 11–16, 2004.
5. Reliability of Flip-Chip and Chip Size Package;Reichl;Microelectronics Reliability,2000
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