Author:
Tsuchiya Hideaki,Yokogawa Shinji
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Hu C-K, Gignac L, Liniger E, Rosenberg R. Proc Int Interconnect Tech Conf 2002;133–135.
2. Analysis of electromigration statistics for Cu interconnects
3. Statistical analysis of early failures in electromigration
4. Nikawa K, and Inoue S. DRIP (Defect Recognition and Image Processing in Semiconductors) VII, Templin, 1997/9/7, Proc. DRIP VII, Inst. Phys. Conf. series no.160, Inst. Physics Publ., Bristol and Philadelphia, 1998;37–46.
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31 articles.
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