Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology-Reference-Cited by-同舟云学术

Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology

Published:2007-07 Issue:7 Volume:47 Page:1103-1112
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kung Huang-Kuang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. http://www.amkor.com/ three-dimensional packages technology solution.

2. http://www.twi.co.uk/.

3. High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology;Kung;Microelectron Eng,2006

4. Roark’s formulas for stress and strain;Young,1975

5. Nguyen LT, Danker A, Santhiran N, Shervin CR. Flow molding of wire sweep during molding of integrated circuits. ASME winter annual meeting, New York: ASME 1992. p. 72–8.

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation optimization of Wire bonding line matching based on FDTD algorithm;2021 13th International Symposium on Antennas, Propagation and EM Theory (ISAPE);2021-12-01

2. Investigation on Bonding Wire Short Caused by Vibration and Its Solution for High-Density Packaged ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-02

3. Study of Complex Looping With Five Kinks in Thermosonic Wire Bonding by Using Variable-Length Link-Spring Model;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-02

4. A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging;Microelectronics Reliability;2017-11

5. Effect of Minute Bends and/or Kinks of Wire Bond Profile on Sag Deflection for 3-D and Multichip Module Semiconductor Packaging;IEEE Transactions on Semiconductor Manufacturing;2016-05