Author:
Bressers H.J.L.,van Driel W.D.,Jansen K.M.B.,Ernst L.J.,Zhang G.Q.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Zhang GQ, Tay A, Ernst LJ. Virtual thermo-mechanical prototyping of electronic packaging – Bottlenecks and solutions of damaging modelling. In: 3rd Electronic Packaging Technology Conference (EPTC), Singapore, 2000.
2. Zhang, GQ, Ernst L, et al. Virtual prototyping: challenges in material characterisation and modelling. In: Proceedings of 51st international conference of ECTC, USA, May 2001.
3. The challenges of virtual prototyping and qualification for future microelectronics;Zhang;J Microelectron Reliab,2003
4. International Technology Roadmap for Semiconductors (ITRS), 2003.
5. Yang DG, Jansen KMB, Ernst LJ, Zhang GQ, van Driel WD, Bressers HJL, et al. Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers. In: Proceedings of the 54rd electronic components and technology conference, Las Vega, USA, June 1–4, 2004.
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献