Author:
Burmer Christian,Görlich Siegfried
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Egger P, Burmer C. SRAM Failure Analysis Strategy. Proc 29th ISTFA 2003:177ff.
2. Long TK, et al. Time Domain Reflectrometry Technique for Failure Analysis. Proc 30th ISTFA 2004:616–22.
3. Scanning SQUID microscopy for current imaging;Knauss;Microelectronics Reliability,2001
4. Nguyen D, To T, Harrison R, Phan C, Drummond J. Dallas Device Analysis Operation. Dallas, Texas: Texas Instruments, Inc.; Proc 30th ISTFA 2004:103–8.
5. Fleuren EM. Avery Sensitive, Simple Analysis Technique using Nematic Liquid Crystals. Proc IEEE IRPS 1983.
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献