Author:
Komoda Hirotaka,Moritani Chie,Takahashi Kazutaka,Watanabe Heiji,Yasutake Kiyoshi
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Hooghan KN, Wills KS, Rodriguez PA, O’Connell S. Integrated circuit device repair using FIB system: tips, tricks, and strategies. In: Proc 25th international symposium for testing and failure analysis, ISTFA 1999, Santa Clara, CA, November 1999. p. 247–54.
2. An example of fault site localization on a 0.18μm CMOS device with combination of front and backside techniques;Yamada;Microelectronics Reliability,2004
3. Application of the focused-ion-beam technique for preparing the cross-sectional sample of chemical vapor deposition diamond thin film for high-resolution transmission electron microscope observation;Tarutani;Jpn J Appl Phys,1992
4. Desplats R, Dargnies T, Courrege JC, Perdu P, Noullet JL. Automatic determination of optimal FIB operations for improved circuit probing and fast reconfiguration. In: Proc 26th international symposium for testing and failure analysis, ISTFA 2000, Bellevue, WA, November 2000. p. 407–14.
5. Anayama T, Lundquist T, Ohuchi T. Success statistics on the FIB editing of first silicon ICs. In: Proc LSI testing symposium, LSITS 2002, Osaka, Japan, November 2002. p. 183–8.
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