Robust Electromigration reliability through engineering optimization-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Robust Electromigration reliability through engineering optimization

Published:2014-09 Issue:9-10 Volume:54 Page:1666-1670
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ng Wee Loon,Tee Kheng Chok,Liu Junfeng,Ee Yong Chiang,Aubel Oliver,Tan Chuan Seng,Pey Kin Leong

Funder

GLOBALFOUNDRIES Singapore Pte. Ltd.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Bashir M et al. Analysis of the impact of metal linewidth variation on low-K dielectric breakdown. IRPS; 2010.

2. Liu W et al. Study of TDDB reliability in misaligned via chain structures. IRPS; 2012.

3. Ng WL et al. Design for reliability through engineering optimization. IRPS; 2013.

4. Aubel O. Constant-current wafer-level electromigration test: normalization of data for production monitoring. TDMR; June 2007.

5. Lee Shun-Yi et al. Real case study for isothermal EM test as a process control methodology. IRPS; 2001.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP