Author:
Lahokallio Sanna,Saarinen-Pulli Kirsi,Frisk Laura
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests;Suhir;J Electron Packaging,2002
2. Electronic component reliability – fundamentals, modelling, evaluation, and assurance;Jensen,1995
3. Accelerated life tests at higher usage rates;Yang;IEEE T Reliab,2005
4. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications;Lin;J Mater Sci,2008
5. Rizvi MJ, Bailey C, Chan YCC, Lu H. Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Proceedings of thermal and thermomechanical phenomena in electronics systems, San Diego California, May 30–June 2; 2006. p. 855–60.
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