Author:
Matters-Kammerer M.,Mackens U.,Reimann K.,Pietig R.,Hennings D.,Schreinemacher B.,Mauczok R.,Gruhlke S.,Martiny C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Design and analysis of embedded inductor on low cost multi-layer laminate MCM technology;Lee;Electr Perform Electron Packaging,2003
2. Electrical behavior of decoupling capacitors embedded in multi-layered PCBs;Mandou;IEEE Trans Electromagnet Compat,2001
3. Stabile PJ, Rosen A, Janton WM, Gombar A, Kolan M. Millimeter wave silicon device and integrated circuit technology. 1984 IEEE Microwave Symposium Digest San Francisco, CA, USA, 29 May–1 June 1984. p. 448–50.
4. Silicon technology for monolithic millimeter wave integrated circuits;Strohm;Mikrowellen-Magazin (West Germany),1988
5. Spirito M, de Vreede LCN, Nanver LK, Mueller JE, Burghartz JN. Low-loss passives for 2nd-harmonic termination control in power amplifiers for mobile applications. 2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers, Grainau, Germany, 9–11 April 2003. p. 49–52.
Cited by
31 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献