Residual stresses in microelectronics induced by thermoset packaging materials during cure-Reference-Cited by-同舟云学术

Residual stresses in microelectronics induced by thermoset packaging materials during cure

Published:2004-12 Issue:12 Volume:44 Page:1985-1994
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Meuwissen Marcel H.H.,de Boer Hedzer A.,Steijvers Henk L.A.H.,Schreurs Piet J.G.,Geers Marc G.D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Zhang GQ, Maessen P, Bisschop J, Janssen J, Kuper F, Ernst LJ. Virtual thermo-mechanical prototyping of microelectronics––the challenges for mechanics professionals. In: Zhang GQ et al., editors. Proceedings of the EuroSimE 2001 Conference, Paris. 2001. p. 21–4

2. A cure shrinkage model for analysing the stresses and strains in encapsulated assemblies;Chambers;Adv. Electron. Packaging, ASME,1992

3. Determination of residual stresses using incremental linear elasticity;Plepys;Compos. Struct,1994

4. Kiasat MS. Curing shrinkage and residual stresses in viscoelastic thermosetting resins and composites. Ph.D. Thesis, Delft University of Technology, The Netherlands, 2000

5. Calculation of stresses in crosslinking polymers;Adolf;J. Compos. Mater,1996

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