Author:
Tee Tong Yan,Zhong Zhaowei
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Baraton X, Herard L, Garnier M, Boillot V. Stacked die package for mass production: an overview. In: Proceedings of the 13th European Microelectronics and Packaging Conference, 2001. p. 330–5
2. Reliability of plastic ball grid array assembly;Darveaux,1995
3. Darveaux R. Solder joint fatigue life model. In: Proceedings of TMS Annual Meeting, Orlando, FL, 1997. p. 213–8
4. Johnson Z. Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability. In: Proceedings of the 49th Electronic Components and Technology Conference, ECTC, USA, 1999. p. 1190–5
5. Mawer A, Vo N, Johnson Z, Lindsay W. Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications. In: Proceedings of the 49th Electronic Components and Technology Conference, ECTC, USA, 1999
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