Author:
Yeh Chang-Lin,Lai Yi-Shao
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. McKenna RG, Mahle RL. High impact bonding to improve reliability of VLSI die in plastic packages. Proc of 39th Electr Comp Technol Conf 1989:424–7
2. Pham CV, Huth K. A new approach to the robust wirebonding. Proc Int Symp Adv Pack Mater 2001:379–85
3. Tran TA, Yong L, Williams B, Chen S, Chen A. Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads. Proc 50th Electr Comp Technol Conf 2000:1674–80
4. Tamura Y, Miyahara Y, Suzuki H. Analysis and application of vibration behavior for wirebonding capillary by transmission laser vibrometer. Proc Electr Manuf Technol Symp 1998:72–75
5. Gonzalez B, Knecht S, Handy H, Ramirez J. The effect of ultrasonic frequency on fine pitch aluminum wedge wirebond. Proc 46th Electr Comp Technol Conf 1996:1078–87
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献