Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry-Reference-Cited by-同舟云学术

Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry

Published:2005-03 Issue:3-4 Volume:45 Page:637-646
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Joo Jinwon,Cho Seungmin,Han Bongtae

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Thermal strain measurements in electronic packages through fractional fringe moiré interferometry;Bastawros;J Electron Pack Trans ASME,1990

5. Experimental determination of thermal strains in semiconductor packaging using moiré interferometry;Guo,1992

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