Systematic evaluation of thermal interface materials—a case study in high power amplifier design-Reference-Cited by-同舟云学术

Systematic evaluation of thermal interface materials—a case study in high power amplifier design

Published:2005-03 Issue:3-4 Volume:45 Page:711-725
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Maguire Luke,Behnia Masud,Morrison Graham

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. International SEMATECH, International Technology Roadmap for Semiconductors, 2003

2. National Electronics Manufacturing Initiative, (NEMI) Technology Roadmap, 2002

3. Philips Semiconductors, Data Sheet: BLW96 HF/VHF power transistor, 1986. p. 1–14

4. Performance and testing of thermal interface materials;Gwinn;Microelectron J,2003

5. Thermal interfacing techniques for electronic equipment—a perspective;Nakayama;Trans ASME,2003

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