Author:
Hamdani Hamid,El Hami Abdelkhalak,Radi Bouchaïb
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Constitutive equations for the rate-dependent deformation of metals at elevated temperatures;Anand;J. Eng. Mater. Technol. ASME,1982
2. ANSYS Guide, ANSYS Structural Analysis Guide 2016.
3. Global sensitivity analysis and multi-objective optimisation of loading path in tube hydroforming process based on metamodelling techniques;Ben Abdessalem;Int. J. Adv. Manuf. Technol.,2014
4. Effect of simulation methodology on solder joint crack growth correlation;Darveaux,2000
5. Darveaux, R., Banerji, K., Mawer, A., Dody, G., Reliability of plastic ball grid array assembly 1995.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献