Modeling simplification for thermal mechanical stress analysis of TSV interposer stack-Reference-Cited by-同舟云学术

Modeling simplification for thermal mechanical stress analysis of TSV interposer stack

Published:2019-05 Issue: Volume:96 Page:46-50
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Xia Kequan,Zhu Zhiyuan,Zhang Hongze,Xu Zhiwei

Funder

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. A review on laser processing in electronic and MEMS packaging;Rahim;J. Electron. Packag.,2017

2. Liu, Y. C., Chang, C. K., Yu, C. Y., Lu, J. R., & Lin, C. H., 2017, U.S. Patent No. 9,666,556. Washington, DC: U.S. Patent and Trademark Office.

3. A quad-core 28–32 GHz transmit/receive 5G phased-array IC with flip-chip packaging in SiGe BiCMOS;Kibaroglu,2017

4. A further study on the analytical model for the permeability in flip-chip packaging;Yao;J. Electron. Packag.,2018

5. Analyses and statistics of the electrical fail for flip chip packaging by using ANSYS simulation software and really underfill materials;Tsai;Microsyst. Technol.,2017

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