Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. N. F. Haddad, R. D. Brown, S. Doyle, S. J. Wright, Radiation hardened memories for space applications, in: 2001 IEEE Aerospace Conference Proceedings (Cat. No.01TH8542), Vol. 5, 2001, pp. 2281–2288 vol.5. doi:https://doi.org/10.1109/AERO.2001.931187.
2. A. Agnesina, A. Sidana, J. Yamaguchi, C. Krutzik, J. Carson, J. Yang-Scharlotta, S. K. Lim, A Novel 3D DRAM Memory Cube Architecture for Space Applications, in: Proceedings of the 55th Annual Design Automation Conference, DAC ’18, ACM, New York, NY, USA, 2018, pp. 24:1–24:6. doi:https://doi.org/10.1145/3195970.3195978. http://doi.acm.org/10.1145/3195970.3195978
3. H. Jun, J. Cho, K. Lee, H. Son, K. Kim, H. Jin, K. Kim, HBM (high bandwidth memory) DRAM technology and architecture, in: 2017 IEEE International Memory Workshop (IMW), 2017, pp. 1–4. doi:https://doi.org/10.1109/IMW.2017.7939084.
4. W. Zhang, T. Li, Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology, in: 2008 41st IEEE/ACM International Symposium on Microarchitecture, 2008, pp. 435–446. 10.1109/MICRO.2008.4771811.
5. L.-J. Chang, Y.-J. Huang, J.-F. Li, Area and reliability efficient ECC scheme for 3D RAMs, in: Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, 2012, pp. 1–4. https://doi.org/10.1109/VLSI-DAT.2012.6212645.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献