Tensile CESL-induced strain dependence on impact ionization efficiency in nMOSFETs

Author:

Wang Bo-Chin,Kang Ting-Kuo,Wu San-Lein,Chang Shoou-Jinn

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Welser J, Hoyt JL, Takagi S, Gibbons JF. Strain dependence of the performance enhancement in strained-Si n-MOSFETs. In: Technical digest of international electron devices meeting; 1994. p. 373–6.

2. Band structure, deformation potentials, and carrier mobility in stained Si, Ge and SiGe alloys;Fischetti;J Appl Phys,1996

3. Comparative study of phonon limited mobility of two-dimensional electrons in strained and unstrained-Si metal–oxide–semiconductor field-effect transistors;Takagi;J Appl Phys,1996

4. Chan V, Rengarajan R, Rovedo N, Jin W, Hook T, Nguyen P, et al. High speed 45nm gate length CMOSFET’s integrated into a 90nm bulk technology incorporating stress engineering. In: Technical digest of international electron devices meeting; 2003. p. 77–80.

5. Uniaxial-process induced strained-Si: extending the CMOS roadmap;Thompson;IEEE Trans Electron Device,2006

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