Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate-Reference-Cited by-同舟云学术

Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate

Published:2011-02 Issue:2 Volume:51 Page:453-459
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Felczak M.,Więcek B.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

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4. Wirtz RA, Dykshoorn P. Heat transfer from arrays of flat packs in a channel flow. In: Proceedings 4th IEPS conference, Baltimore, p. 318–26.

5. Forced air cooling of low profile air cooling;Wirtz,1996

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