An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method

Author:

Nwanoro Kenneth Chimezie,Lu Hua,Yin Chunyan,Bailey Chris

Funder

University of Greenwich

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Heavy Al Ribbon: An Alternative Solution for Hybrid Power Packaging;Ong,2004

2. Automatic wedge bonding with ribbon wire for high frequency applications;Ivy,2002

3. S. Jacques, R. Leroy and M. Lethiecq, “Impact of aluminium wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling application,” Microelectronics Reliability, Elsevier, vol. 55, pp. 1821–1825.

4. Evaluation of the 2010 Toyota Prius Hybdrid Synergy Drive System;Buress,2011

5. Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics module;Nwanoro,2017

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