Author:
Dreher P.,Schmidt R.,Vetter A.,Hepp J.,Karl A.,Brabec C.J.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Novel large area joining technique for improved power device performance;Schwarzbauer;IEEE Trans. Ind. Appl.,1991
2. Intelligent power module family SKiiP - 4th generation;Beckedahl,2009
3. Power cycle testing of sintered SiC MOSFETs;Schmidt,2017
4. Power cycling capability of modules with SiC diodes;Herold,2014
5. Quality evaluation for silver sintering layers in power electronic modules;Rudzki,2012
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献