Funder
University of Queensland-Nihon Superior
University of Queensland International Scholarship
China Scholarship Council Scholarship
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference68 articles.
1. The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections;Mattila,2012
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4. Cyclic twin nucleation in tin-based solder alloys;Lehman;Acta Mater.,2010
5. The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints;Bieler;J. Electron. Mater.,2012
Cited by
29 articles.
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