Author:
Cai Jinhao,Ding Lijian,Wang Jianing,Jiang Nan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Ageing and failure modes of IGBT modules in high-temperature power cycling;Smet;IEEE Trans. Ind. Electron.,2011
2. Power cycle testing of power switches: a literature survey;GopiReddy;IEEE Trans. Power Electron.,2015
3. Influence and mechanism analysis of load pulse duration on failure mode of high power IGBT module under power cycling condition;Jie;Chin. Soc. Electr. Eng.,2020
4. Fast Power Cycling Test of IGBT Modules in Traction Application;Held,1997
5. Power Cycling Induced Failure Mechanisms in Solder Layers;Herrmann,2007
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献