Funder
Natural Sciences and Engineering Research Council of Canada
Semiconductor Research Corporation
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Electromigration in thin aluminum films on titanium nitride;Blech;J. Appl. Phys.,1976
2. Personal Communication;Sukharev,2020
3. Stress evolution due to electromigration in confined metal lines;Korhonen;J. Appl. Phys.,1993
4. Power grid electromigration checking using physics-based models;Chatterjee;IEEE Trans. Computer-aided Des. Integr. Circuits Syst.,2018
5. The determination of the elastic field of an ellipsoidal inclusion, and related problems;Eshelby;Proc. R. Soc. A,1957
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