Author:
Shi Xinghua,Qiu Yuanying,Jia Fei,Ma Hongbo
Funder
Shanghai Academy of Spaceflight Technology
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Moisture diffusion modeling – a critical review;Wong;Microelectron. Reliab.,2016
2. Analysis of package cracking during reflow soldering process;Kitano,1988
3. A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements;Ardebili;IEEE Trans. Comp. Packag. Technol.,2002
4. Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses;Tee,2002
5. A micromechanics approach for polymeric material failures in microelectronic packaging;Fan,2002
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献