Influence of thermal interface material using discrete Si-IGBTs and consideration of power cycling conditions-Reference-Cited by-同舟云学术

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Influence of thermal interface material using discrete Si-IGBTs and consideration of power cycling conditions

Published:2023-11 Issue: Volume:150 Page:115089
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Heimler Patrick,Günther Marco,Künzel Cesare,Lutz Josef,Basler Thomas

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. Y. Zhao, E. Deng, L. Xie, J. Liu and Y. Huang, "Influence of TIM and Encapsulation on Power Cycling Capability of Discrete Devices," PCIM Europe 2022

2. International exhibition and conference for power electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2022, pp. 1-6, doi: 10.30420/565822283.

3. Fischer Elektronik GmbH & Co. KG, "Datenblatt Produkt THFM ... ," Available: https://www.fischerelektronik.de/web_fischer/de_DE/VA/THFM1/datasheet.xhtml;jsessionid=82E4E1999951A6E75EEC7A86C76F8FC7?branch=K%C3%BChlk%C3%B6rper.

4. Isolier- und Messtechnik GmbH & Co KG, "Type SB-HIS," 2020; Available: https://www.detakta.de/fileadmin/datenblaetter/wlf/SB-HIS.pdf.

5. Keramische Folien GmbH, " Keratherm – red standard films," 2022; Available: https://www.kerafol.com/_wpframe_custom/downloads/files/Kerafol_WLF_Datenblaetter_86_82_11-22___144833-11112022.pdf.

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