Author:
Tomas Ariane,Frémont Hélène,Malbert Nathalie,Neffati Mehdy,Lambert Benoit
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. K. M. B. Jansen, M. F. Zhang, L. J. Ernst, D.-K. Vu, and L. Weiss, Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material, Microelectron. Reliab., vol. 107, p. 113596, avril 2020, doi: https://doi.org/10.1016/j.microrel.2020.113596.
2. Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds;Shirangi;EuroSimE 2008,2008
3. Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds;Fan,2010
4. M. D. Placette, X. Fan, J.-H. Zhao, and D. Edwards, Dual stage modeling of moisture absorption and desorption in epoxy mold compounds, Microelectron. Reliab., vol. 52, no. 7, pp. 1401–1408, Jul. 2012, doi: https://doi.org/10.1016/j.microrel.2012.03.008.
5. J. Cocaud, A. Célino, S. Fréour, and F. Jacquemin, Vers une méthodologie d'identification des paramètres de diffusion d'eau dans les polymères et composites., 2017.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. THz-TDS for IC packaging material changes detection under real-world conditions;Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII;2024-03-11