Author:
Zhang Jun-an,Li Chao,Li Dan,Zhang Chuandao,Li Tiehu,Lu Yunhua,Zhang Qingwei
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Hot-carrier reliability and performance study of transistors with variable gate-to-drain/source overlap;P. Devoge a b c Person Envelope;Microelectron. Reliab.,2022
2. Soft error hardening enhancement analysis of NBTI tolerant Schmitt trigger circuit;Shah;Microelectron. Reliab.,2020
3. Impact of transistor scaling on the time-dependent dielectric breakdown (TDDB) reliability of analog circuits;Saniç,2017
4. Stress migration followed by electromigration reliability testing;Passage,2019
5. Hot carrier degradation in cryo-CMOS;Chakraborty,2020