Author:
Lee Yonghwa,Castellazzi Alberto
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. High performance silicon carbide power packaging—past trends, present practices, and future directions;Seal;Energies,2017
2. Multi-chip SiC MOSFET power modules for standard manufacturing, mounting and cooling. In 2018 international power electronics conference (IPEC-Niigata 2018-ECCE Asia) (pp. 130-136);Castellazzi;IEEE,2018
3. Integrated motor drive using soft-switching current-source inverters with Sick-and GaN-based bidirectional switches;Dai;ECCE,2020
4. Guacci M, Tatic M, Bortis D, Kolar JW, Kinoshita Y, Ishida H. Novel three-phase two-third-modulated buck-boost current source inverter system employing dual-gate monolithic bidirectional GaN e-FETs. PEDG2019, Jun 3 2019.
5. Lee Y., Castellazzi A. Implementation options of a fully SiC Buck-CSI for advanced motor drive application. EPE'22 ECCE Europe, Sep. 2022.