Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation-Reference-Cited by-同舟云学术

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Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation

Published:2020-11 Issue: Volume:114 Page:113813
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kulkarni R.,Soltani M.,Krafft S.,Groezinger T.,Zimmermann A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Encapsulation Technologies for Electronic Applications;Ardebili,2018

2. Feasibility of Manufacturing Packaged Electronic Systems by Thermoset Injection Molding;Kulkarni,2017

3. An assessment of thermoset injection molding for thin-walled conformal encapsulation of board-level electronic packages;Kulkarni;Journal of Manufacturing and Materials Processing,2019

4. Untersuchungen zu Zuverlässigkeit und Lebensdauermodellen für gelötete SMD auf spritzgegossenen Schaltungsträgern; engl: Studies on reliability and lifetime models for soldered SMD on injection molded circuit carriers;Grözinger,2015

5. Untersuchungen zu Zuverlässigkeit und Entwärmung von LEDs auf räumlichen Schaltungsträgern; engl: Studies on reliability and heat dissipation of LEDs on spatial circuit carriers;Soltani,2019

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