1. Kataoka K, Itoh T, Okumura K, Suga T. Development of low-force copper contact processes. In: Proceedings of the 49th international conference IEEE Holm conference on electrical contacts, Washington, DC, USA; 2003. p. 228–33.
2. Varnau MJ. Impact of wafer probe damage on flip chip yields and reliability. In: Proceedings of the 19th electronics manufacturing technology symposium, Austin, TX, USA; 1996. p. 293–7.
3. Tan Q, Beddingfield C, Mistry A. Reliability evaluation of probe-before-bump technology. In: Proceedings of the 24th electronics manufacturing technology symposium, Austin, TX, USA; 1999. p. 320–4.
4. Hotchkiss G, Ryan G, Subido W, Broz J, Mitchell S, Rincon R, et al. Effects of probe damage on wire bond integrity. In: Proceedings of the 51st electronic component technology conference, Orlando, FL, USA; 2001. p. 1175–80.
5. An investigation into the effects of probing and wire bonding stress on the reliability of BOAC;Chen;Microelectron Reliab,2006