Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing

Author:

Schlangen R.,Leihkauf R.,Kerst U.,Lundquist T.,Egger P.,Boit C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Siebert J, Johri L, McCarty D, Voong S, Sengupta M, Wang H. Enhanced scanning control of charged particle beam systems. US Patent 7,230,240.

2. Boit C, Kerst U, Schlangen R, Kabakow A, Le Roy E, Lundquist T, et al. Impact of backside circuit edit on active device performance in bulk silicon ICs. In: Proc. 37th IEEE ITC, vol. 48.2; 2005.

3. Schlangen R, Leihkauf R, Lundquist T, Egger P, Kerst U, Boit C. Trimming of IC timing and delay by backside FIB processing – comparison of conventional and strained technologies. In: Proc. IEEE IEDM; 2008. p. 439–42.

4. Effect of floating body charge on SOI MOSFET design;Wei;Trans Electron Dev,1998

5. Schlangen R, Leihkauf R, Lundquist T, Egger P, Kerst U, Boit C. RF performance increase allowing ic timing adjustments by use of backside fib processing. In: Proc. 16th IEEE IPFA; 2009. p. 33–6.

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