Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

Author:

Hein VerenaORCID,Erstling Marco,Sethu Raj Sekar,Weide-Zaage Kirsten,Bai Tianlin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Tummala R., Wolter K.-J., Sundaram V., Smet V., Raj P. M. by Georgia Tech and its automotive partners; new era in automotive electronics, a co-development. In: Proc. SMTA PanPac 2016.

2. Reliability Issues in Automotive Microelectronic Components and Systems;Kanert,2012

3. Introduction to electromigration-aware physical design;Lienig,2006

4. A design for highly robust metallization stack;Hein,2016

5. Modeling of the reservoir effect on electromigration lifetime;Nguyen,2001

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