An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages-Reference-Cited by-同舟云学术

An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages

Published:2016-07 Issue: Volume:62 Page:18-25
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Poshtan Emad A.,Rzepka Sven,Silber Christian,Wunderle Bernhard

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. A modified button-shear method for measuring fracture toughness of polymer–metal interfaces in IC packages;Tay,2003

2. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J. Appl. Mech.,1989

3. Modified four-point bending specimen for determining the interface fracture energy for thin, brittle layers;Hofinger;Int. J. Fract.,1998

4. Interfacial fracture parameters of silicon-to-molding compound;Schlottig,2010

5. Establishing fracture properties of EMC-copper (-oxide) interfaces: test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity;Ernst,2009

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

2. A measurement structure for in-situ electrical monitoring of cyclic delamination;Surface and Coatings Technology;2022-09

3. Characterization of interfacial parameters for lifetime modelling in modern optical sensor package assemblies;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

4. Thermomechanical fatigue damage modeling and material parameter calibration for thin film metallizations;International Journal of Fatigue;2022-02

5. Physics of Failure Based Simulation and Experimental Testing of Quad Flat No-Lead Package;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05