Analysis of electrical parameters of InGaN-based LED packages with aging-Reference-Cited by-同舟云学术

Analysis of electrical parameters of InGaN-based LED packages with aging

Published:2016-11 Issue: Volume:66 Page:22-31
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Jayawardena Asiri^ORCID,Narendran Nadarajah

Funder

Federal Aviation Administration

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference59 articles.

1. A method for projecting useful life of LED lighting systems;Narendran;Proc. SPIE Int. Soc. Opt. Eng.,2004

2. Solid-state lighting: Failure analysis of white LEDs;Narendran;J. Cryst. Growth,2004

3. Improved performance white LED;Narendran;Proc. SPIE5941, Fifth Int. Conf. Solid State Lighting,2005

4. Advances in transparent glass–ceramic phosphors for white light-emitting diodes—a review;Chen;J. Eur. Ceram. Soc.,2015

5. Survey of high-temperature polymeric encapsulants for power electronics packaging;Yao;IEEE Trans. Compon. Packag. Manuf. Technol.,2015

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