An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system-Reference-Cited by-同舟云学术

An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system

Published:2016-05 Issue: Volume:60 Page:109-115
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liu Dapeng,Wang Jing,Liu Ruiyang,Park S.B.^ORCID

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference26 articles.

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4. Mechanics of moisture for polymers: fundamental concepts and model study, thermal, mechanical and multi-physics simulation and experiments in microelectronics and micro-systems, 2008;Fan,2008

5. Moisture diffusion and heat transfer in plastic IC packages;Tay;Components Packag. Manuf. Technol. A IEEE Trans.,1996

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