Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy-Reference-Cited by-同舟云学术

Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy

Published:2016-09 Issue: Volume:64 Page:370-374
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Grünwald E.,Rosc J.,Hammer R.,Czurratis P.,Koch M.,Kraft J.,Schrank F.,Brunner R.

Funder

ENIAC Joint Undertaking

ACINTECH

Austrian Federal Government

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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