Author:
Rösch S.,Rauchfuss H.,Wallentowitz S.,Wild T.,Herkersdorf A.
Funder
German Research Foundation (DFG)
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Agent-based thermal management using real-time I/O communication relocation for 3D many-cores;Ebi,2011
2. Task Migration in Multi-tiled MPSoC: Challenges, State-of-the-art and Preliminary Solutions;Elantably,2012
3. Task migration for fault-tolerance in mixed-criticality embedded systems;Saraswat;SIGBED Rev.,2009
4. Supporting task migration in multi-processor systems-on-chip: a feasibility study;Bertozzi,2006
5. Evaluating the impact of task migration in multi-processor systems-on-chip;Almeida,2010
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1. Editorial;Microelectronics Reliability;2016-06