Enhanced thermal characterization method of microscale heatsink structures-Reference-Cited by-同舟云学术

Enhanced thermal characterization method of microscale heatsink structures

Published:2016-12 Issue: Volume:67 Page:21-28
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Takács G.,Szabó P.G.,Bognár Gy.

Funder

Hungarian Scientific Research Fund (OTKA)

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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5. Logi-Thermal Simulation Using Accurate Temperature Dependent Delay Models, in: Proceedings of the 19th International Workshop on THERMal INvestigation of ICs and Systems: THERMINIC 2013, Berlin, Germany;Timar,2013

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