Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Failure modes and failure analysis;Caers,2013
2. Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED;Jeong;Microelectronics Reliability,2008
3. Failure mechanisms and reliability issues in LEDs;Pecht,2013
4. Packaging effects on reliability of Cu/low-k interconnects;Wang;IEEE Transactions on Device and Materials Reliability,2003
5. Chip-packaging interaction: a critical concern for Cu/low k packaging;Wang;Microelectronics Reliability,2005
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