Similarity approach for reducing qualification tests of electronic components-Reference-Cited by-同舟云学术

Similarity approach for reducing qualification tests of electronic components

Published:2016-12 Issue: Volume:67 Page:111-119
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Stoyanov Stoyan,Bailey Chris,Tourloukis Georgios

Funder

Selex ES

Micross Components Ltd.

Cassidian (Airbus Defence and Space)

Rolls Royce

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. C.A. Preussger, R. Blish, S. Huber, T. Dellin and N. Lycoudes (2004) “Understanding and Developing Knowledge-based Qualifications of Silicon Devices”, Technology Transfer #04024492A–TR International SEMATECH, available at: http://www.sematech.org/docubase/document/4492atr.pdf

2. Computational Intelligence: And Introduction;Engelbrecht,2007

3. Computational Intelligence Paradigms: Theory and Applications Using MATLAB;Sumathi,2010

4. Computational Intelligence and Its Applications;Lam,2012

5. Similarity-based methods: a general framework for classification, approximation and association;Duch;Control. Cybern.,2000

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