Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications-Reference-Cited by-同舟云学术

Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications

Published:2007-09 Issue:9-11 Volume:47 Page:1779-1783
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lhommeau T.,Perpiñà X.,Martin C.,Meuret R.,Mermet-Guyennet M.,Karama M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Lhommeau T, Meuret R, Karama M. Technological study of a module IGBT for an aeronautical application in zone engine. In: Proceedings of EPE, Dresden, Germany; 2005.

2. Hamidi A, Coquery G, Lallemand R. Reliability of high power IGBT modules – testing on thermal fatigue effects due to traction cycles. In: Proceedings of EPE; 1997. p. 3118–23.

3. Boundary element analysis of thermal fatigue effects on high power IGBT modules;Khatir;Microelectron Reliab,2004

4. Dupont L, Khatir Z, Lefebvre S, Bontemps S. Evaluation of substrate technologies under high temperature cycling. In: Proceedings of CIPS, Naples, Italy; 2006.

5. Hayashi K, Izuta G, Murakami K, Uegai Y, Takao H. Improvement of fatigue life of solder joints by thickness control of solder with wire bump technique. In: Proceedings of ECTC, San Diego, USA; 2002. p. 1469–74.

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