1. Wong EH, Rajoo R, Mai YW, Seah SKW, Tsai KT, Yap LM. Drop impact: fundamentals and impact characterisation of solder joints. In: Proceeding of the 55th electronic components and technology conference. Lake Buena Vista, FL; 2005. p. 1202–09.
2. Evaluation of solder joint strengths under ball impact test;Lai;Microelectron Reliab,2007
3. Performance of QFP lead-free solder joints under dynamic mechanical loading;Arra;Int J Microcirc Electron Pack,2001
4. Irving S, Liu Y. Free drop test simulation for portable IC package by implicit transient dynamics FEM. In: Proceedings of the 54th electronic components and technology conference, Las Vegas, NV; 2004, p. 1062–6.
5. Yeh C-L, Lai Y-S. Effect of solder joint shapes on free drop reliability of chip-scale packages. In: Proceeding of the IMAPS taiwan technical symposium 2004, Kaohsiung, Taiwan; 2004.