WITHDRAWN: Update on CGA packages for space applications-Reference-Cited by-同舟云学术

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WITHDRAWN: Update on CGA packages for space applications

Published:2016-01 Issue: Volume: Page:
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ghaffarian Reza

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference56 articles.

1. CCGA packages for space applications;Ghaffarian;Microelectron. Reliab.,2006

2. International Technology Roadmap for Semiconductors, ITRS (website), http://www.itrs.net/, (accessed Nov 15, 2015).

3. International Electronics Manufacturing Initiatives (website), INEMI, http://www.inemi.org/, (accessed Nov. 15, 2015).

4. IPC, Association Connecting Electronics Industry (website), http://www.ipc.org, (accessed Nov. 15, 2015).

5. OEA, Organic and Printed Electronics Association (web page), http://www.oe-a.org/roadmap, (accessed Nov. 15, 2015).

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